Effects of flux formulation temperature on printing and wetting properties of Sn–3.0Ag–0.5Cu solder, Journal of Materials Science: Materials in Electronics, 2019, 30, 8493–8501


저자 이름이 에스오디랑 똑같고 그대학이라 아마 맞을듯?
저거외엔 다 국내학술지더라